Vacuum Chuck
A vacuum chuck is a component that holds the substrate using vacuum pressure. The ceramic vacuum chucks we mainly supply are used in inspection/metrology equipment and hybrid bonding equipment.
The main materials are S-SiC, Si-SiC, Si3N4, and Al2O3, and various materials are considered depending on the performance requirements of the equipment. We typically begin at the design and development stage of vacuum chucks, working in close collaboration with equipment manufacturers based on the specific requirements of each tool.
Leveraging extensive design experience, we apply a wide range of vacuum chuck know-how, including designs optimized for flatness, solutions to address wafer warpage, and methods to minimize deformation during mounting.
Available Supply Types
|
Item |
Main Supply Types |
|
Process Application |
•Semiconductor inspection and
metrology processes
•Hybrid bonding process
•Wafer/Chip grinding and polishing
processes
•Some single-wafer or batch-type
CVD processes
|
|
Main Materials |
SiC, Si-SiC, Si3N4, Al2O3, porous ceramics, etc. |
|
Product Types |
•Pattern: pin type, ring type,
anti-warp type, etc.
•Form: patterned chuck, porous
chuck
|
Main Supply Levels
|
Level |
Description |
Manufacturing Process (Standard) |
|
New |
All New |
SiC powder → Forming → (Green machining) → Sintering → Final machining → (Yellow lapping) → Patterning → Lapping/Polishing & in-process inspection → Final inspection → Cleaning + Assembly + Packaging |
Manufacturing Process
Product Image
